Products Laser Diode Spacers/Submounts Low Expansion Wafers RF Submounts/Carriers Optoelectronic Components Brazing/Assemblies Microelectronic Bases & Housings   Material Technology Tungsten Copper Molybdenum Copper Tungsten Alloys Pure and Porous Refractory Metals             Products         Home  > Products   Laser Diode Spacers/Submounts Combining Spectra-Mat’s high quality composite materials with our precision refractory machining capability yields submounts/carriers with exceptional physical properties. View Details Low Expansion Wafers Spectra-Mat has developed a comprehensive process to ensure the exacting requirements of lithography grade substrates for wafer level packaging. View Details RF Submounts/Carriers Spectra-Mat supplies various configurations of submounts and carriers for RF and microwave packaging requirements for both ground-based and airborne applications from all of our LEC materials. View Details   Optoelectronic Components The combination of SMI's high quality low expansion materials with our exacting refractory machining capability creates components with demanding edge quality and flatness characteristics critical to optoelectronic packaging. View Details Brazing/Assemblies Spectra-Mat has leveraged our expertise in brazing in our traditional product lines to include device packaging assemblies that may include several diverse materials (i.e. metallized ceramics, Kovar and LECs) View Details Microelectronic Bases & Housings Spectra-Mat’s unique material manufacturing and precision machining process make it possible to make complex Z-axis housings made entirely from our LEC materials. View Details       we support your innovation

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