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Material Technology |
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| Home > Material Technology |
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SMI’s Low Expansion Composite (LEC) materials are all developed with a high purity press, sinter and infiltrate technology that ensures exceptional engineering properties. From our superior thermal conductivity, stability and tailored thermal expansion, your stringent requirements are readily met. No additives are used in any of our processes.
We provide several options of low expansion materials to meet your thermal expansion component requirements:
(a) composites made of Tungsten Copper (WC) and Molybdenum Copper (MC), with CTE's ranging from 6.2 to 7.9
(b) Tungsten Heavy Alloy (WHA) with a CTE of 5.2
(c) Pure refractory metals Tungsten (W) with a CTE of 4.6, and Molybdenum (Mo) with a CTE of 5.5
From prototype development to production runs, we support your innovation. |
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SEM View
Polished, etched surfaces shown |
Spectra-Mat's "Powder to Parts" process technology provides a very consistent microstructure in our Low Expansion Composites. |
Optical View
Polished, etched surfaces shown |
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| Spectra-Mat's unique LEC process offers the following advantages: |
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Ability to vary metal matrix density to achieve optimum combination of CTE and TC values |
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Outstanding dimensional stability unaffected by high temperature cycling |
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Components with exceptional flatness, edge radius and surface finish |
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Superior thermal conductivity compared to competitive products |
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Metallization capability including electrolytic and electroless plating as well as thin film deposition |
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No additives are used in our process |
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All materials/components are RoHS compliant |
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| we support your innovation |
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