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RF Submounts/Carriers
 
RF Submounts/Carriers
Also used at chip level for die attach
May be used within a Kovar or other material housing for CTE match and thermal dissipation directly from the chip
Precision machining allows a variety of configurations
Exceptional flatness and dimensional tolerance control
Ni and Au plating available
 
 
Download Technical Bulletin
PB-500-B LEC for Thermal Management in Device Packaging
PB-600-B Molybdenum Copper Components
 
Download Instructions
Please right click on the above links and choose option "Save Target As" / "Save Link As" to download the PDF file on your computer.
 
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