| Low Expansion Wafers |
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Used in wafer level packaging to create integrated submount during semiconductor process |
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Can create significant packaging cost savings |
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High temperature annealed to maintain flatness during subsequent temperature processing |
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Provided for applications such as: high power laser diodes, high brightness LEDs, concentrated photovoltaics, RF and optoelectronics |
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Substrate diameters offered are 2", 3", 100mm, and 150mm |
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Mo/Cu substrates may be patterned for use in MEMS or MMIC applications |
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Alternative materials offered are pure W and Mo for lower CTE matching |
